Appearance specifications
|
size |
1280mm (W)x1180mm (D)x1920mm (H) (without signal ) |
|
weight |
750KG |
|
color |
Rice white |
Electrical specifications
|
Positive pressure |
4.0-5.5Kg/cm3(recommended 5Kg/cm3). |
|
Negative pressure |
-0.8Kg/cm3 or more |
|
Voltage input |
AC220V 50/60HZ/16A |
|
Consume power |
3500W |
Control mode
|
Control the host |
Industrial ( computers (multi-core processor systems).) |
|
operating system |
WINDOWS 7 PROFESSION (32-bit). ) |
|
Hmi |
17-inch console screen, keyboard, and mouse operation |
The module specifications
|
The pressure range of the P-P ARM |
20~200 grams |
|
The nozzle fixes the size of the healing device |
The diameter of the shank is 3.0mm |
|
Wafer Frame size standard |
7-inch Ring Frame |
|
The wafer carries the maximum size |
Ø203mm (8 Inches) |
|
Rotate the angle to make up the range |
-15 to .15 |
|
Solid crystal range size |
80mm × 80mm |
|
Bin Frame size |
215mm × 220mm |
|
The thimble uses dimensions |
Ø0.7mm × 10°(deg.) ×17mm(L) |
|
Gray-order camera |
CCD2 group |
|
Optical lens (Lens) adjustable magnrate |
1.0X |
|
Coaxial Lights 2 ( Lights) |
|
|
Side lights 2 groups ( Red light) |
Production product specifications
|
Chip size |
6×6 (mil) ~ 120×120 (mil) |
|
Surface condition |
Smooth and coarse surfaces |
|
Chip thickness |
50um ~ 350um |
Crop specifications
|
CYCLE TIME |
80~120 ms/unit |
|
Solid crystal accuracy |
(X/Y/θ)±30um / ±30um / ±3° |
|
The maximum number of classes (Bin Qty). |
150 Categories |
0755 - 6112 0988
SZZY8100@sina.com.cn
Wushigang Industrial Park, Huada Road, Gaofeng Street, Longhua
